| 价格 | 面议 |
|---|---|
| 品牌 | 爱赛克 |
| 区域 | 全国 |
| 来源 | 深圳市衡鹏瑞和科技有限公司 |
详情描述：
爱赛克底部填充胶39-ICH08_UNDERFILL 爱赛克底部填充胶39-ICH08_underfill use for low temperature solder Package.This product which balanced curing agent. It is possible to obtain characteristic of both LOW CTE and LOW TEMP CURING. 39-ICH08_爱赛克底部填充胶特长： Liquid state Property Typical Value Test Condition Chemical Epoxy (Black) Specific Gravity 1.4 @25度 Thixotropic index 1.0 12s-1/120s-1 Viscosity 4.200 mPa?s Cone plate type, 120s-1 Cured state Property Typical Value Test Condition Tensile Modulus 4.6 Gpa 25度, DMA Tg 120度 DMS CTE α1/α2 39/105 ppm/度 TMA Tensile shear strength 16 Mpa JIS K 6850 Volume resistivity 2.28 x 1015Ω?cm JIS K 6911 Surface resistivity 9.7 x 1015Ω JIS K 6911 Dielectric constant 3.08 1.0GHz 3.05 2.45GHz Dielectric loss tangent 0.015 1.0GHz 0.015 2.45GHz 爱赛克UNDERFILL底部填充胶39-ICH08相关产品： 衡鹏供应 爱赛克UNDERFILL底部填充胶39-ICH09
| 联系人 | 刘庆 |
|---|
